Core Advantagess
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Core Advantagess
CSP R&D
Chip R&D
Epitaxial R&D
R&D philosophy

As the core part of LED products, epitaxy is like the engine in a car. The epitaxial technology center includes the epitaxial R&D department, cutting-edge laboratory, and epitaxial process department. Starting from market demand, we comprehensively guarantee the leading, stable, and reliable performance of our products through basic research on epitaxial materials, device characteristics and mechanisms, epitaxial structure design and development, product evaluation and analysis, mass production conversion, yield improvement, and cost reduction.

  • 01.
    R&D model leader
    Efficient integration of mechanism research and practical experience
  • 02.
    Layout of the entire industry chain from substrate to packaging
    Accurately addressing customer pain points
  • 03.
    Customer centricity
    Exploring cutting-edge technologies and combining product application scenarios to empower customers
R&D advantages
  • Leading R&D design model
    Starting from material research, starting from device mechanism research, gradually moving towards the exploration and control of physical mechanisms. Based on rich practical experience, predict the physical behavior of devices, and develop LED structure design based on such research and development, ultimately meeting the needs of customers.
  • A professional R&D team
    Internationalized R&D team: All members have 8-10 years of experience in R&D in leading domestic and foreign industry enterprises, with core management and technical backbone having more than 10 years of industry experience.
  • Advantages of the entire industry chain
    The R&D of LED structures starts from the correlation of overall devices, and takes into account overall design considerations such as carrier transport, radiative and non radiative electro-optical conversion, light extraction efficiency, light divergence angle, and ultimately the excitation efficiency of fluorescent powders. Establish a R&D mindset that considers the entire industry chain from substrate, epitaxial, chip, and packaging, achieving a 1+1>2 effect and meeting the overall performance needs of customers.