Mini COB, also known as Chip on Board, is a frameless integrated packaging technology that directly attaches LED flip chips onto a PCB board for overall packaging without the need for any brackets or solder pins. The backlight module can achieve a lighter and thinner design. COB has technological advantages such as high density, high protection, high reliability, high adaptability, high image quality, and wide color gamut.
Chip scale package (CSP) does not have the necessary brackets for traditional packaging, so CSP is the COB solution, and CSP can also be used as a white light solution.
Mini POB is a packaging technology solution of Mini LED backlighting technology, which first packages LED chips into single SMD LED beads, and then places the beads on the substrate.